FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C/W, 22 mm, 27 mm, 27 mm Current Sensors When wrapped firmly around cables

When wrapped firmly around cables with 50% overlap & earthed at both ends

such as high-quality pre-amp

The sleeving provides continuous abrasion protection for wires

of Contacts 8 Contact Product Range Brad Series Contact Material - Connector Mounting Cable Mount Other details

SCREW product from MULTICOMP with the model number MC001533Product details

FISCHER ELEKTRONIK ICK BGA 27 X 27 X 22 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13.5 °C/W, 22 mm, 27 mm, 27 mm Current Sensors When wrapped firmly around cablesThis is a Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 13. 5 C W, 22 mm, 27 mm, 27 mm product from FISCHER ELEKTRONIK with the model number ICK BGA 27 X 27 X 22Product details Packages Cooled BGA Thermal Resistance 13. 5C W External Height Metric 22mm External Width Metric 27mm External Length Metric 27mm External Diameter Metric Heat Sink Material Aluminium External Height Imperial 0. 87" External Width Imperial 1. 06" External Length Imperial