FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Cokin CX495B Powers from P-Tap/D-Tap

Powers from P-Tap/D-Tap

4H filter) Power Requirements 12VDC

Variable color temperature from 3

Reset Temperature 100°C Contact Rating 120VAC/15A

UPC: 050234010245

FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Cokin CX495B Powers from P-Tap/D-TapThe ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors. 1. 8mm Plate thickness Applications Industrial Product details External Diameter Metric Packages Cooled BGA, PLCC Heat Sink Material Aluminium Thermal Resistance 23C W External Length